논문
> 사업성과 > 논문
|
Title | Effect of sodium dodecyl sulphate on Cu electrodeposition: interaction with hydrophobic substrate and Cu ions |
|---|---|---|
| Journal | Transactions of the IMF | |
| Research Group | 조성기 교수 | |
| Authors | In Ui Kim, Ye Ri Gwon, Yeong Min Shin, Sung Ki Cho | |
| Classification | SCI(E) | |
| Date | 2022-01-11 | |
| Impact Factor | 1.9 | |
| JIF Percentile | 50.6 | |
| ISSN No. | 0020-2967 | |
| Vol. / Page | - | |
| File | ||
| Link | Link |
| 이전글 | Magnetic cluster-encapsulated polymer dimers with ... |
|---|---|
| 다음글 | Quantification of sonochemical and sonophysical ef... |
| 목록 |
